A nature of a wafer-thin can be different and it can be hard, thin, thick, hard, rough or very smooth. Often, the stress and strain of such different type of wafer-thins or objects are evaluated by the Normal-Context-Area (NCA), which is the complete portion of the head which is pressured. The real and the nominal surface is avoided, but it is very hard and cannot be ignored at all the time. In this study, some new experiments are performed. These experiments help to obtain the evaluation of the relationship between the real contact area & the initial load is proposed. A new method is introduced with this way and the actual contact area between pressure head and the examined wafer-thin is same. The final results will show the relationship and difference between the real & nominal stress-strain nature of the wafer-thin.